Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging
Book Details
Format
Paperback / Softback
ISBN-10
3031005759
ISBN-13
9783031005756
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Dec 31st, 2007
Print length
108 Pages
Product Classification:
Engineering: generalElectrical engineeringElectronics engineering
AI Summary
Ksh 5,050.00
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Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
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