Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Book Details
Format
Hardback or Cased Book
ISBN-10
1845695283
ISBN-13
9781845695286
Publisher
Elsevier Science & Technology
Imprint
Woodhead Publishing Ltd
Country of Manufacture
GB
Country of Publication
GB
Publication Date
May 22nd, 2015
Print length
482 Pages
Weight
830 grams
Product Classification:
Electronics engineering
AI Summary
Ksh 28,100.00
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Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.
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