Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Softcover reprint of the original 1st ed. 2018
by
Jie Cheng
Book Details
Format
Paperback / Softback
Book Series
Springer Theses
ISBN-10
9811355851
ISBN-13
9789811355851
Edition
Softcover reprint of the original 1st ed. 2018
Publisher
Springer Verlag, Singapore
Imprint
Springer Verlag, Singapore
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jan 30th, 2019
Print length
137 Pages
AI Summary
Ksh 16,200.00
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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
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