Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Softcover reprint of the original 1st ed. 2018
by
Jie Cheng
Book Details
Format
Paperback / Softback
Book Series
Springer Theses
ISBN-10
9811355851
ISBN-13
9789811355851
Edition
Softcover reprint of the original 1st ed. 2018
Publisher
Springer Verlag, Singapore
Imprint
Springer Verlag, Singapore
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jan 30th, 2019
Print length
137 Pages
AI Summary
Ksh 16,200.00
Werezi Extended Catalogue
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
Get Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer Verlag, Singapore and it has pages.
Discover books you might love based on this title.
More in This Genre
Digital Transformation of Industry
Ksh 13,500.00
Computer Integration Engineering Design and Production
Ksh 25,900.00
Foundations of the Theory of Elasticity, Plasticity, and Viscoelasticity
Ksh 14,950.00
Scanning Probe Microscopy
Ksh 12,600.00
Fundamentals of Polymer Engineering, Third Edition
Ksh 21,800.00
Peptide-based Biomaterials
Ksh 32,200.00
