Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia

2023 ed.

Book Details

Format Hardback or Cased Book

Book Series Springer Proceedings in Physics

ISBN-10 9811992665

ISBN-13 9789811992667

Edition 2023 ed.

Publisher Springer Verlag, Singapore

Imprint Springer Verlag, Singapore

Country of Manufacture GB

Country of Publication GB

Publication Date Jul 3rd, 2023

Print length 875 Pages

Product Classification: Condensed matter physics (liquid state & solid state physics)Chemistry Sustainability Electronics engineering

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This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ?

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