Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
by
ASME
Book Details
Format
Paperback / Softback
ISBN-10
0791859320
ISBN-13
9780791859322
Publisher
American Society of Mechanical Engineers,U.S.
Imprint
American Society of Mechanical Engineers,U.S.
Country of Manufacture
US
Country of Publication
GB
Publication Date
Jun 30th, 2020
Print length
836 Pages
Weight
1,884 grams
Dimensions
21.50 x 27.90 x 4.80 cms
Product Classification:
Mechanical engineering
AI Summary
Ksh 47,350.00
Temporarily out of stock, due soon
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
No description available for this book.
Get Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019) by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by American Society of Mechanical Engineers,U.S. and it has pages.
Discover books you might love based on this title.
More in This Genre
Fundamentals of Helicopter Dynamics
Ksh 12,050.00
Functionalized Biopolymers
Ksh 36,550.00
Computer-Integrated Engineering Design and Manufacture
Ksh 26,300.00
Fundamentals of Optomechanics
Ksh 11,150.00
Huebner’s Finite Element Method for Engineers, Fif th Edition
Ksh 19,650.00
Metal Forming Processes
Ksh 27,900.00
