New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
Book Details
Format
Paperback / Softback
ISBN-10
3031008995
ISBN-13
9783031008993
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Feb 16th, 2016
Print length
72 Pages
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Ksh 4,500.00
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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
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