Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing

by Shen Liu , Yong Liu

Book Details

Format Hardback or Cased Book

ISBN-10 0470827807

ISBN-13 9780470827802

Publisher John Wiley & Sons Inc

Imprint John Wiley & Sons Inc

Country of Manufacture SG

Country of Publication GB

Publication Date Oct 21st, 2011

Print length 576 Pages

Weight 1,134 grams

Dimensions 25.20 x 17.50 x 3.60 cms

Product Classification: Production engineering Electronics engineering

AI Summary

Ksh 19,800.00

Werezi Extended Catalogue 0 in stock

Delivery Location

County

Location

Delivery fee: Select location

Secure

Quality

Fast

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Get Modeling and Simulation for Microelectronic Packaging Assembly by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by John Wiley & Sons Inc and it has pages.