Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 : Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.
Book Details
Format
Paperback / Softback
Book Series
MRS Proceedings
ISBN-10
1107408717
ISBN-13
9781107408715
Publisher
Cambridge University Press
Imprint
Cambridge University Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 5th, 2014
Print length
358 Pages
Weight
48 grams
Dimensions
22.90 x 15.20 x 1.90 cms
Product Classification:
Materials science
AI Summary
Ksh 5,050.00
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This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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