Introduction to Microelectronics Advanced Packaging Assurance
Book Details
AI Summary
Delivery Location
Delivery fee: Select location
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
Get Introduction to Microelectronics Advanced Packaging Assurance by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer International Publishing AG and it has pages.
Discover books you might love based on this title.
More in This Genre
Inside Radio: An Attack and Defense Guide
Ksh 10,800.00
Microfluidics and Biosensors in Cancer Research
Ksh 27,000.00
Increasing Naturalness and Flexibility in Spoken Dialogue Interaction
Ksh 27,000.00
ISUW 2019
Ksh 39,600.00
Advanced Computational Paradigms and Hybrid Intelligent Computing
Ksh 36,000.00
Analog and Digital Electronic Circuits
Ksh 9,900.00
