Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

by Karl J. Puttlitz , Kathleen A. Stalter

Book Details

Format Hardback or Cased Book

Book Series Mechanical Engineering

ISBN-10 0824748700

ISBN-13 9780824748708

Publisher Taylor & Francis Inc

Imprint CRC Press Inc

Country of Manufacture US

Country of Publication GB

Publication Date Feb 27th, 2004

Print length 1044 Pages

Weight 2,140 grams

Dimensions 18.10 x 26.10 x 6.40 cms

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Ksh 75,600.00

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Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Get Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Inc and it has pages.