Chiplet Design and Heterogeneous Integration Packaging

2023 ed.

by John H. Lau

Book Details

Format Hardback or Cased Book

ISBN-10 9811999163

ISBN-13 9789811999161

Edition 2023 ed.

Publisher Springer Verlag, Singapore

Imprint Springer Verlag, Singapore

Country of Manufacture GB

Country of Publication GB

Publication Date Mar 28th, 2023

Print length 525 Pages

Weight 1,068 grams

Dimensions 16.20 x 24.20 x 3.30 cms

Product Classification: Precision instruments manufacture Circuits & components

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Ksh 28,800.00

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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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