3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
2022 ed.
Book Details
Format
Paperback / Softback
ISBN-10
3030982319
ISBN-13
9783030982317
Edition
2022 ed.
Publisher
Springer Nature Switzerland AG
Imprint
Springer Nature Switzerland AG
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Jun 29th, 2023
Print length
395 Pages
Product Classification:
Circuits & componentsEmbedded systemsComputer architecture & logic design
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Ksh 19,800.00
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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
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